A binding apparatus includes a pressure bonding mechanism in which pressure is applied by a pair of pressure bonding plates to a joining portion of a binding tape, which is an adhesive tape, to fasten it together by gripping and squeezing a pair of levers to rotate a pair of arms around a fulcrum. Thereby, any mixing of metal staples into an object to be bound as in a conventional binding apparatus is eliminated, and thus the quality of the object to be bound can be ensured. Further, the need for a strong grip strength like that when ejecting a staple is eliminated, and thus the burden on an operator can be reduced.
