An endoscope includes an imaging device that is provided in a tip portion of an insertion part. The imaging device includes an image-sensor that an image receiving surface thereof is disposed crossing a longitudinal direction of the insertion part, a substrate folded once or more that includes a sensor connecting portion which faces a surface of the image-sensor on which connection terminals are provided and is connected to the connection terminals and a wire connecting portion which extends from an outer end of the sensor connecting portion toward a base end side of the insertion part and a center of the image receiving surface, and a composite wire of which a plurality of cables connected to a cable connection surface of the wire connecting portion facing the base end of the insertion part are bundled. The composite wire includes a first shield conductor provided around the plurality of cables that are bundled.
