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LOW APPLICATION TEMPERATURE HOT MELT ADHESIVE BASED ON STYRENE COPOLYMERS
专利权人:
BOSTIK; INC.
发明人:
ABBA, FABIENNE,MOREL-FOURRIER, CHRISTOPHE,SAJOT, NICOLAS EDGARD
申请号:
CA2625528
公开号:
CA2625528C
申请日:
2006.10.10
申请国别(地区):
CA
年份:
2013
代理人:
摘要:
A hot melt adhesive composition, comprising a blend of components includingabout 10% to about 40% by weight of an elastomeric block copolymer, preferablystyrene-isoprene-styrene (SIS) or styrene-butadiene-styrene (SBS), about 15%to about 70% by weight of a first midblock tackifying resin having a softeningpoint of at least about 110~C and having an aromatic content of at least about1.5% by weight about 0 to 55% of second midblock tackifying resin, about 5%to about 35% by weight of a plasticizer and about 0% to about 20% by weightof an end block resin having a softening point lower than 125~C wherein thecomponents total 100% by weight of the composition, the viscosity of thecomposition is equal to or less than about 20,000 mPa.s at 12O~C, and isapplied at a temperature lower that 150~C and initial bond retention of thecomposition on elastic strands is at least about 60%. Also, the elasticmodulus G of the composition is higher than about 5000 Pa, the vicous modulesG" is higher than about 50 Pa, and the tan delta value is between about 0.5and about 60. Laminates, especially those used in disposable soft goods, andmethods of making such laminates are also described. The adhesive compositionand/or laminate may be used in making a variety of end products such as adisposable diaper, a sanitary napkin, a bed pad, a bandage, a surgical drape,a tape, a label, a plastic sheet, a nonwoven sheet, a paper sheet, acardboard, a book, a filter, or a package.
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