One imaging unit is provided, in image-forming module and endoscopic system make it possible to realize distal end insertion part that diameter reduces and with the image that obtains high quality. The semiconductor packages 20 according to the present invention of imaging unit 10, it includes imaging sensor, connection electrode 21 is formed in face f2, the first multilager base plate 30, formed including multiple connection electrodes 31,33 be cleaved into right angle f3 and f4 and be connected to semiconductor packages 20 by connection electrode 31, the second multilager base plate 40, multilager base plate 30 is connected to 40 layers of direction of first and second multilager base plate perpendicular to first multilager base plate 30 in layer direction, electronic component 51, one is mounted in the first multilager base plate 30, cable 60, the other end and the second multilager base plate 40. Second multilager base plate 40 is connected to the first multilager base plate 30 to form T-type, and the first multilager base plate 30 and the second multilager base plate 40 are located at the semiconductor packages 20 for being projected in optical axis direction in plane.
