Keith W. Seitz,Xiaohong Tang,William C. Thiebolt,Jonathan Calamel,Thomas Shi,Thomas Marzano
申请号：
US15936495
公开号：
US20180272137A1
申请日:
2018.03.27
申请国别(地区):
US
年份:
2018
代理人:
摘要：
Disclosed herein are electrically conductive and hermetic vias disposed within an insulator substrate of a feedthrough assembly and methods for making and using the same. Such aspects of the present invention consequently provide for the miniaturization of feedthrough assemblies inasmuch as the feedthrough components of the present invention are capable of supporting very small and hermetic conductively filled via holes in the absence of additional components, such as, for example, terminal pins, leadwires, and the like.
