John A. Simpson,Jeffrey F. Dooley,Matthew J. Gillick
申请号：
US16897784
公开号：
US20200298332A1
申请日:
2020.06.10
申请国别(地区):
US
年份:
2020
代理人:
摘要：
The present disclosure is directed to a multi-segment device, such as an intravascular guide wire. The multi-segment device includes an elongate first portion comprising a first metallic material, an elongate second portion comprising a different metallic material, the first and second elongate portions being directly joined together end to end by a solid-state weld, and a heat affected zone surrounding an interface of the weld where the first and second portions are joined together, wherein the heat affected zone has an average thickness of less than about 0.20 mm.
