Daryl R. Kipke,Rio J. Vetter,Kc Kong,Jamille Hetke,David Anderson
申请号：
US13556715
公开号：
US09248269B2
申请日:
2012.07.24
申请国别(地区):
US
年份:
2016
代理人:
摘要：
An apparatus comprises a flexible substrate including a modular electrode array disposed on the flexible substrate. The modular electrode array includes a plurality of electrode modules, where an electrode module includes a plurality of electrodes. The flexible substrate also includes a spatial separation between the electrode modules of the modular electrode array, and conductive interconnect coupled to the electrodes of the plurality of electrodes.
