The invention relates to a pressure-sensitive adhesive compound comprising a polymer component and a saccharide component, wherein the saccharide component is formed from one or more monosaccharides, disaccharides, oligosaccharides, or polysaccharides, and/or one or more modified saccharide derivatives, which can be derived from monosaccharides, disaccharides, oligosaccharides, or polysaccharides by modifying one, several, or all OH groups contained in the respective saccharide. The invention further relates to the use of such pressure-sensitive adhesive compounds, in particular for the electronics industry.
