Laurent Blanquart,Joshua D. Talbert,Jeremiah D. Henley,Donald M. Wichern
申请号：
US15156240
公开号：
US20160256041A1
申请日:
2016.05.16
申请国别(地区):
US
年份:
2016
代理人:
摘要：
An endoscopic device having embodiments of a hybrid imaging sensor that optimizes a pixel array area on a substrate using a stacking scheme for placement of related circuitry with minimal vertical interconnects between stacked substrates and associated features are disclosed. Embodiments of maximized pixel array size/die size (area optimization) are disclosed, and an optimized imaging sensor providing improved image quality, improved functionality, and improved form factors for specific applications common to the industry of digital imaging are also disclosed. Embodiments of the above may include systems, methods and processes for staggering ADC or column circuit bumps in a column or sub-column hybrid image sensor using vertical interconnects are also disclosed.
