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Hybrid packing for implantable device
专利权人:
发明人:
Peng Cong,Bernard Li
申请号:
US13799860
公开号:
US08805537B1
申请日:
2013.03.13
申请国别(地区):
US
年份:
2014
代理人:
摘要:
Described herein is a device configured to be implanted into a live human or animal. The device includes an electrically non-conductive frame one or more electrical components disposed in the electrically non-conductive frame and a self-supporting film. The self-supporting film forms a hermetical seal with the electrically non-conductive frame. The self-supporting film and the frame enclose the electrical components. The device is configured to be implanted into a live human or animal. Also described herein is a method of making a device configured to be implanted into a live human or animal. The method includes providing an electrically non-conductive frame comprising one or more feedthroughs, openings and a cavity disposing electrical components within the cavity optionally filling the cavity with a material to embed the electrical components in the material and sealing the openings by applying a self-supporting film to the one or more openings.
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中国工程科技知识中心
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http://www.ckcest.cn/home/

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