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Hybrid Implant System and Manufacturing Method Therefor
专利权人:
The Chinese University of Hong Kong
发明人:
Ling Qin,Yuk Sun CHENG,Ning TANG,Wing Ho CHAU
申请号:
US15874532
公开号:
US20180207327A1
申请日:
2018.01.18
申请国别(地区):
US
年份:
2018
代理人:
摘要:
The present disclosure discloses a hybrid implant system for fixing and repairing orthopedic fracture and a manufacturing method therefor. The hybrid implant system comprises an implant body having holes on both ends and a locking part configured for attaching the implant body to a broken bone through the holes. The hybrid implant system further comprises a healing assembly made from a material promoting healing of the bone. The implant body has at least one window on a side, the at least one window is aligned with a broken location of the bone, and the healing assembly is inserted into the window in a self-locking manner towards an interior of the implant body.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/
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