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Methods, devices and systems for sensor with removable nodes
专利权人:
QUALCOMM Incorporated
发明人:
Kenneth Kaskoun,Brian David Niznik,Michael David Atella
申请号:
US15212428
公开号:
US09974484B2
申请日:
2016.07.18
申请国别(地区):
US
年份:
2018
代理人:
摘要:
An integrated adhesive sensor array includes an adhesive a patch, a sensor hub, and a detachable sensor pod packaged as a unit. The patch may include a docking area for the detachable sensor pod. The detachable sensor pod may include at least one sensor and may be configured to be detached from the patch and applied to various locations on a body. The detachable sensor pod may send sensor data to the sensor hub via a wired link when on the patch and via a wireless link when detached from the patch. The sensor hub receives sensor data from the various sensors, and relays the data to a receiver. The sensor hub and detachable sensor pod may include indicators for communicating information. The sensor hub may include a power source for powering the sensor hub and a detachable sensor pod attached to the main sensor unit or patch.
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