Base polymer for hot-melt adhesive agent, and hot-melt adhesive agent

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专利权人:

IDEMITSU KOSAN CO.; LTD.

发明人:

Kazuhiro Hashima,Tomoaki Takebe,Yutaka Minami,Masao Inoue,Kenji Kobayashi

申请号：

US14894152

公开号：

US09725626B2

申请日:

2014.05.27

申请国别(地区):

US

年份:

2017

代理人:

摘要：

Provided is a hot-melt adhesive which satisfies both solidification rate and adhesiveness. A base polymer for a hot-melt adhesive which satisfies the following (1) and (2): (1) a modulus of elasticity in tension at 23° C. is 400 MPa or less； and (2) a semi-crystallization time at 23° C. is 20 minutes or less.

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中国工程科技知识中心

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http://www.ckcest.cn/home/