Niraj Maniar,Kevin Froster,Charles Jacob Shotmeyer
申请号：
US16282866
公开号：
US20200268527A1
申请日:
2019.02.22
申请国别(地区):
US
年份:
2020
代理人:
摘要：
An assembly for attachment to a first implant component has a size and shape of a second implant component to be implanted together with the first implant component. The assembly includes a first body and a second body removably connected to the first body. In a temporary configuration, the first and second bodies are prevented from separating while the first and second bodies permit relative movement therebetween. A modular kit includes a plurality of the first bodies each having a different size or shape, and a plurality of the second bodies each having a different size or shape. A method of assembling the assembly includes removably connecting the first body to the second body, such that the first and second bodies are prevented from separating while permitting relative movement therebetween, and positioning the assembly on the first implant component.
