An implantable medical device lead includes an inner conductor assembly coupled to a first electrode at a distal end of the inner conductor assembly and an outer conductive coil extending coaxially with the inner conductor assembly and coupled to a second electrode. The inner conductor assembly includes one or more filars arranged in a plurality of serially connected current suppression modules. Each current suppression module includes a first coil of the one or more filars wound in a first winding direction, a second coil of the one or more filars coaxial with the first winding and wound in a second winding direction opposite the first winding direction, and a third coil of the one or more filars coaxial with the first and second windings and wound in the first winding direction. The outer conductive coil includes one or more filars wound in the first winding direction.
