The imaging device 1 includes a light receiving surface 10SA, a facing surface 10SB, and an inclined surface 10SS inclined at a first angle θ1, and the imaging device 10 having a plurality of light receiving surface electrodes 12 formed on the light receiving surface 10SA. Each of the plurality of light receiving surface electrodes 12 and the wiring board 40 having the plurality of wirings 41W to which the cover glass 30 is connected, and the cover glass 30 and the plurality of light receiving surface electrodes 12 are inclined surfaces. The back surface of the light-receiving surface electrode 12 is exposed to the opposite surface side and extends to the outside of the edge of 10SS, and the tip of the wiring 41W has a complementary angle with respect to the first angle θ1. 2 is a flying lead that is bent at an angle θ2 of 2 and is electrically connected to the light-receiving surface electrode 12, and the distal end portion of the wiring board 40 is fixed to the facing surface 10 SB of the image sensor 10.撮像装置１は、受光面１０ＳＡと対向面１０ＳＢと第１の角度θ１で傾斜している傾斜面１０ＳＳとを有し、受光面１０ＳＡに複数の受光面電極１２が形成されている撮像素子１０と、カバーガラス３０と、複数の受光面電極１２のそれぞれと、それぞれが接続されている複数の配線４１Ｗを有する配線板４０と、を具備し、カバーガラス３０および複数の受光面電極１２が傾斜面１０ＳＳの端辺の外側まで延設されており受光面電極１２の裏面が対向面側に露出しており、配線４１Ｗの先端部が、第１の角度θ１に対して補角の関係にある第２の角度θ２に曲がった、受光面電極１２と電気的に接続されているフライングリードであり、配線板４０の先端部が撮像素子１０の対向面１０ＳＢに固定されている。
