A gripping apparatus includes: a temperature adjusting device held in a substrate wherein the substrate defines an open region； a phase change material held within the open region and thermally coupled with the temperature adjusting device such that a temperature change in the temperature adjusting device causes a temperature change in the phase change material； and a controller connected to the temperature adjusting device and configured to send a signal to the temperature adjusting device to change its temperature and thereby change the temperature of the phase change material that is thermally coupled with the temperature adjusting device. The phase change material is either in a solid state and configured to grip a stick or in a liquid state and the phase change material and configured to loosen its grip on the stick such that the stick is capable of moving through the phase change material.
