Chein-Hsun WANG,Ming LE,Yu-Chih LIANG,Tung Yang LEE,Chih-Yung TSAI
申请号：
US16441916
公开号：
US20200249101A1
申请日:
2019.06.14
申请国别(地区):
US
年份:
2020
代理人:
摘要：
A thermal sensor package for earbuds includes two thermopile sensor elements on a single thermopile sensor chip, and the two thermopile sensor elements are separated by a block wall of a cap. One of the thermopile sensor elements senses external infrared thermal radiation through a window of the cap, and the other thermopile sensor element senses internal infrared thermal radiation from a package structure as a basis for correcting compensation. Therefore, the foregoing thermal sensor package for earbuds can quickly correct a measurement error caused by the package structure to improve the measurement accuracy. In addition, the forgoing thermal sensor package for earbuds has a simple packaging step and is easy to arrange a silicon based infrared lens to expand its application.
