The present disclosure concerns packaging adapted to accommodate a series of implant components, e.g. femoral components for artificial knee joints, which vary in size but have a common thickness dimension. The packaging is designed to provide a clearance between its internal parts which approximates this common thickness dimension but is also able to accommodate variations in the other dimensions of the implant components. In a convenient approach, a base portion is provided which has a vertical projection with a top surface adapted to support a portion of the inner surface of the major arch of the components of said series. It is mated with a second structural member which has an arcurate surface whose contour approximates a portion of the outside surface of the major arch of the components in this series. Means are provided for holding it in a fixed special relationship with said base portion.
