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Ultrasonic transducer, manufacturing method thereof, ultrasonic transducer array and ultrasonic inspection apparatus
专利权人:
株式会社日立製作所
发明人:
町田 俊太郎,龍崎 大介,永田 達也,山下 尚昭,花岡 裕子,吉村 保廣
申请号:
JP2014196805
公开号:
JP6251661B2
申请日:
2014.09.26
申请国别(地区):
JP
年份:
2017
代理人:
摘要:
A structure that prevents a substrate from being warped is provided on a region or a location other than a membrane that determines the characteristics of a CMUT. In a CMUT in a structure in which a first conductive layer and a second conductive layer are provided sandwiching a cavity on a substrate, for example, as a warpage prevention structure, a warpage prevention layer that prevents the substrate from being warped is provided between the substrate and the first conductive film. When the insulating film disposed between the cavity and the first conductive film and the insulating film disposed between the cavity and the second conductive film are silicon oxide films, the warpage prevention layer includes a silicon nitride film.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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