Adhesive molecules

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专利权人:

THE CHUGOKU ELECTRIC POWER CO., INC.;SESSILE RESEARCH CORPORATION

发明人:

Tsukasa Yoshizaki,Keiji Yamashita,Kyoko Kamiya,Kohichi Suzuki,Yoshio Hayashi

申请号：

US15561194

公开号：

US10590320B2

申请日:

2015.03.23

申请国别(地区):

US

年份:

2020

代理人:

摘要：

To provide novel adhesive molecules. An adhesive molecule having an amino acid sequence of SEQ ID NO. 1, or an amino acid sequence including a conservative substitution, a deletion, an insertion and/or a modification in the sequence of SEQ ID NO. 1.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/