METHOD FOR MANUFACTURING HIGH ASPECT RATIO STRUCTURE, METHOD FOR PRODUCING ULTRASONIC PROBE, HIGH ASPECT RATIO STRUCTURE, AND X-RAY IMAGE PICKUP DEVICE
PROBLEM TO BE SOLVED: To provide a method for manufacturing a high aspect ratio structure capable of producing a high-aspect-ratio structure having a higher dimensional accuracy, a method for manufacturing an ultrasonic probe, a high-aspect-ratio structure, and an X-ray imaging device using the same.SOLUTION: The method for manufacturing a high aspect ratio structure according to the present invention includes a hole forming step for forming a plurality of holes PEa extending in a direction crossing a main surface on at least one main surface of a predetermined substrate 13, a region defining step for defining a first region AR1 for forming a recessed portion 134 in a next recessed portion forming step and a second region AR2 for forming no recessed portion 134 on the main surface formed with a plurality of holes Pea, a recessed part forming step for forming a recessed part 134 on a substrate 13 corresponding to the first region AR by dipping in an etching solution, and a partition wall thinning hole forming step in which a plurality of holes PEa are formed so that a partition wall thickness between adjacent holes PEa becomes thinner at the bottom side of the hole PEa than that at the main surface side.SELECTED DRAWING: Figure 7COPYRIGHT: (C)2018,JPO&INPIT【課題】本発明は、より寸法精度の高い高アスペクト比構造物を製造できる高アスペクト比構造物の製造方法、超音波プローブの製造方法および高アスペクト比構造物ならびにこれを用いたＸ線撮像装置を提供する。【解決手段】本発明の高アスペクト比構造物の製造方法は、所定の基板１３の少なくとも一つの主面に、主面に交差する方向に延びる複数の穴ＰＥａを形成する穴形成工程と、複数の穴ＰＥaを形成した主面に、次の凹部形成工程で凹部１３４を形成する第１領域ＡＲ１と凹部１３４を形成しない第２領域ＡＲ２とを規定する領域規定工程と、エッチング液の中に浸漬することによって第１領域ＡＲに対応する基板１３に凹部１３４を形成する凹部形成工程とを備え、前記穴形成工程は、互いに隣接する穴ＰＥａ間の隔壁厚さが、主面側より穴ＰＥａの底部側の方が薄くなるように、複数の穴ＰＥａを形成する隔壁薄化穴形成工程を含む。【選択図】図７
