Systems and processes to dispense, clean and sanitize the key exposure points in the filling process to reduce risk of mold, yeast, or bacteria product spoilage, with minimal downtime. In some embodiments, a process uses a chemical solution that includes a liquid including potable water or another liquid—such as paramagnetic water, ultrapure water, R.O. water or any other kind of modified water—and a biocide solution such as sodium hypochlorite, stabilized chlorine dioxide, etc. at concentrations between 0.5 and 200 ppm or any of the components of electrochemical activated (EAC) water. In some embodiments, the water has a low enough chemical concentration to allow application without a follow-up rinse. The high ORP water at high pressure and flow removes the statically charged particles, preventing micro growth in between sprays, and effectively cleaning and sanitizing in a single step.
