An imaging apparatus for an electronic endoscope includes a bare chip of CCD, a circuit board with approximately the same thickness as the bare chip, and a conducting plate with no less than 1/4 width of the bare chip. The bare chip has terminals on the surface with an imaging surface. The terminals are arranged near the edge facing the rear end of an insertion section of the electronic endoscope. The circuit board has terminals on the surface near the edge facing the front end of the insertion section. These terminals are connected by wire bonding. The conducting plate is attached along one side of the rear surface of the CCD and the circuit board for electrical connection. A forceps channel is provided such that its outer circumference fits partially into a cut portion formed on the rear surfaces of the CCD and the circuit board by the conducting plate.
