Le Neel Olivier,Shankar Ravi,Cherian Suman,Leung Calvin,Loh Tien-Choy,Kam Shian-Yeu
申请号：
US201715605825
公开号：
US10094797(B2)
申请日:
2017.05.25
申请国别(地区):
美国
年份:
2018
代理人:
Seed IP Law Group LLP
摘要：
A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile c
