Disclosed is an ultrasonic probe having an improved heat radiation capability. The ultrasonic probe includes a transducer module configured to transmit and receive an ultrasonic signal, a housing configured to accommodate the transducer module, a cable connected to the transducer module inside the housing and drawn from the inside of the housing to the outside of the housing through an end of the housing, a bending device configured to cover the cable and connected to the end of the housing to receive heat, a strain relief configured to surround the bending device and including a heat radiation groove extending along a circumferential direction of the cable, and a heat radiation fin inserted into the heat radiation groove such that one end thereof is in contact with the bending device and the other end thereof is in contact with outside air.
