PROBLEM TO BE SOLVED: To reduce manufacturing cost by downsizing a housing and also simplifying an assembly process.SOLUTION: An ultrasonic probe manufacturing method assembles an ultrasonic probe including a probe substrate on a first main surface of which laminated oscillators are mounted and on a second main surface of which sensor electrodes connected to the laminated oscillators are formed, and an interposer substrate where interposer electrodes 141a are formed on the first main surface arranged toward the second main surface of the probe substrate, and an external electrode is formed on the second main surface, and a processing IC is mounted. The method comprises: forming a metal bump on the interposer electrodes of the interposer substrate supplying conductive paste is supplied onto the metal bump positioning the sensor electrodes on the second main surface of the probe substrate and the interposer electrodes and curing the conductive paste.SELECTED DRAWING: Figure 3DCOPYRIGHT: (C)2017,JPO&INPIT【課題】筐体を小型化すると共に、組立工程を簡略化し、製造コストを低減すること。【解決手段】第1主面に積層振動子が実装され、第2主面に上記積層振動子に接続されたセンサ電極が形成されたプローブ基板と、上記プローブ基板の第2主面に向けて配置された第1主面に中継電極141aが形成され、第2主面に外部電極が形成され、処理ICが実装された中継基板とを有する超音波プローブを組み立てる超音波プローブ製造方法において、上記中継基板の上記中継電極に金属バンプを形成し、上記金属バンプ上へ導電ペーストを供給し、上記プローブ基板の第2主面のセンサ電極と上記中継電極とを位置決めし、上記導電ペーストを硬化する。【選択図】図3D
