Thomas Ritch;Liya Wang;Jessica Russell;Hiroyuki Fukushima
发明人:
Hiroyuki Fukushima,Thomas Ritch,Jessica Russell,Liya Wang
申请号：
US15285967
公开号：
US10568544B2
申请日:
2016.10.05
申请国别(地区):
US
年份:
2020
代理人:
摘要：
The development and manufacture of thermal interface materials including, among other forms, greases, pastes, gels, adhesives, pads, sheets, solders and phase change materials, with good through-plane thermal conductivity for thermal interface applications. The good through-plane thermal conductivity is achieved through the formation of a conductive network by the use of thermal conductive material-coated fillers, combinations of thermal conductive material-coated fillers and uncoated fillers.
