A spaghetti squash apparatus includes microwaveable packaging configured to contain spaghetti squash. The spaghetti squash has a skin of the spaghetti squash removed and the spaghetti squash is cut into a predetermined number of spaghetti squash portions, the predetermined number of spaghetti squash portions being packaged in the microwaveable packaging based on weight. Additionally, the spaghetti squash apparatus includes instructions for spaghetti squash preparation located on the packaging. The instructions include heating the spaghetti squash portions in the microwaveable packaging, cooling the spaghetti squash portions in the microwaveable packaging, and interacting with the spaghetti squash portions in the microwaveable packaging until noodles are formed.
