An applicator instrument for applying dental compounds includes an instrument head. The instrument head has a support structure with a plurality of elastic projections formed on the support structure. The projections have less stiffness than the support structure with respect to a height extent and enclose a receiving space for the dental compound. Additionally, the projections have a planar configuration and are arranged substantially parallel to one another with respect to a width extent. The diameter of the instrument head is equal to or less than 3 mm. Using this applicator instrument, it is easier to apply dental compound in dosed amounts and to spread the dental compound across a surface to be treated.
