Yoon Jin Lee,Yun-Sil Lee,Hae-June Lee,Seo-Hyun Choi,Kyeng-Jung Kim
申请号：
US13817760
公开号：
US08815243B2
申请日:
2011.08.18
申请国别(地区):
US
年份:
2014
代理人:
摘要：
The present invention relates to a pharmaceutical composition for promoting angiogenesis, containing an antibody that specifically binds to heat shock protein (HSP) 27. In addition, the present invention relates to a pharmaceutical composition containing an antibody that specifically binds to HSP 27, for treating an angiogenesis-dependent ailment selected from a group consisting of a wound, chronic ulcer, ischemic stroke, myocardial infarction, angina pectoris, and cerebrovascular dementia. In addition, the present invention relates to a method for promoting the in vitro growth of endothelial cells using an antibody that specifically binds to HSP27. In addition, the present invention relates to a method for screening for active substances for promoting angiogenesis or for active substances for treating an angiogenesis-dependent ailment, the method comprising the following steps: treating vascular endothelial cell lines with each specimen measuring the content of HSP27 in the respective vascular endothelial cell lines and selecting a specimen in which the HSP27 content in the vascular endothelial cell lines are decreased as compared to a control group.
