A method of assembling an implantable electrode array (40) is presented. The meth-od includes the step of providing a coupon (108) formed from plastically deformable material and shaping at least one section of the coupon (108) to define at least one carrier (74). After said step of defining the carrier (74), the coupon is mounted to a substrate (140). Further, insulating material and conductive material is bonded on the at least one carrier (74) to form at least one electrode (48) and at least one conductor (62). The carrier is removed from the substrate (140) and the assembly consisting of the carrier (74), the at least one electrode (48) and the at least one conductor (62) is lifted off from the substrate so that as a result of the lifting off of the assembly, the assembly forms the implantable electrode array (40) with a curved shape.
