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PACKAGE FOR A MEDICAL DEVICE
专利权人:
UFP Technologies; Inc.
发明人:
David R. Knowlton,Daniel J. Shaw, JR.,Jeffrey Ryan Masters,Michael Joseph King
申请号:
US15788101
公开号:
US20180036092A1
申请日:
2017.10.19
申请国别(地区):
US
年份:
2018
代理人:
摘要:
A package for a medical device includes a blister having a base and a plurality of walls extending from the base with the base and the walls defining a cavity for receiving the medical device. The blister includes a first thermoplastic polyurethane or a combination of the first thermoplastic polyurethane and polyethylene terephthalate glycol. The package also includes a lid disposed on the blister and at least partially covering the cavity. The lid has outer and inner surfaces and includes a high density polyethylene. The package further includes an insert disposed on and in direct contact with the inner surface of the lid and facing the cavity. The insert includes a second thermoplastic polyurethane for increasing puncture resistance of the lid from the medical device.
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