METHOD FOR ELECTROLESS PLATING

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专利权人:

Rohm and Haas Electronic Materials LLC

发明人:

Hakiri Yoshiyuki

申请号：

US201715818937

公开号：

US2018179634(A1)

申请日:

2017.11.21

申请国别(地区):

美国

年份:

2018

代理人:

摘要：

To provide a conditioner having less foaming property and having adhesion higher than the conventional conditioner using a cationic polymer or the like and, and an electroless plating method using the same. A method of the present invention for performing an electroless plating including the steps of:

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中国工程科技知识中心

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http://www.ckcest.cn/home/