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Interbody spinal implants with extravertebral support plates
专利权人:
William Armstrong;Rajesh Remesh;Anthony J. Melkent;Brian Thoren
发明人:
Anthony J. Melkent,Brian Thoren,William Armstrong,Rajesh Remesh
申请号:
US12854732
公开号:
US08480747B2
申请日:
2010.08.11
申请国别(地区):
US
年份:
2013
代理人:
摘要:
An implant assembly for a spinal column includes at least a plate and an interbody implant attached to the plate. The interbody implant is positioned in the spinal disc space and the plate extends extradiscally for attachment to the first and second vertebrae outside the disc space. The assembly may include recesses in the bottom surface of the plate, spacers, and spacing portions extending from the bottom surface of the plate that allow the plate to be secured to the interbody implant when the trailing end of the interbody implant is positioned in a recessed, flush or overhanging position relative to the laterally facing surfaces of the vertebrae.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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