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Stent Connector Bump Design
专利权人:
Brian Tischler
发明人:
Brian Tischler,Dennis Peiffer,James F. Hemerick,Chad Perrin
申请号:
US13191814
公开号:
US20120029618A1
申请日:
2011.07.27
申请国别(地区):
US
年份:
2012
代理人:
摘要:
An endoprosthesis comprises a plurality of serpentine bands. Each serpentine band comprises a plurality of interconnected struts forming peaks and troughs. Adjacent serpentine bands are interconnected by one or more connectors. First and second serpentine bands are connected via at least one connector. The connector has a first side facing one the struts and a second side facing another of the struts. The connector extends from an inside of a trough of the first serpentine bands to the outside of a trough of the other of the serpentine bands. The connector has a first bump extending from the first side and a second bump extending from the second side opposite the first, the first bump located adjacent a first peak and the second bump located adjacent a second peak.
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中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/
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