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メタライズ半導体表面での再結合特性の抽出方法
专利权人:
アイメック・ヴェーゼットウェーIMEC VZW;カトリーケ・ユニフェルシテイト・ルーヴァンKatholieke Universiteit Leuven
发明人:
ヤン・デッケルス
申请号:
JP20140185502
公开号:
JP6272741(B2)
申请日:
2014.09.11
申请国别(地区):
日本
年份:
2018
代理人:
摘要:
The present disclosure relates to methods for determining recombination characteristics at metallized semiconductor surfaces and of metallized semiconductor junctions, based on photo-conductance decay measurements. Dedicated test structures are used comprising a plurality of metal features in contact with a semiconductor surface at predetermined locations, the metal features being provided in a plurality of zones, each of the plurality of zones having a different metal coverage. The method comprises performing a photo-conductance decay measurement in each of the plurality of zones, thereby determining effective lifetimes for different injection levels as a function of metal coverage; and extracting the recombination characteristics from the measured effective lifetimes.
来源网站:
中国工程科技知识中心
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