A device for collection waste from a body includes a collecting pouch and an adhesive wafer connected to the collecting pouch for attaching the collecting pouch to the body. The adhesive wafer includes at least one intermediate layer of adhesive, a skin facing layer of adhesive, a first film layer, and a second film layer. The first film layer is formed of backing layer material, and is positioned between the skin facing layer of adhesive and the intermediate layer of adhesive. The second film layer is formed of backing layer material. The second film layer is positioned adjacent to the intermediate layer of adhesive on an opposite side of the intermediate layer of adhesive from the first film layer. The first film layer is configured to reduce a peel force of the adhesive wafer.
