An electronic module (1) on a flexible planar circuit substrate (3) with a conductor configuration (3b) on a first substrate surface and a plurality of electronic components (5)on the opposite, second substrate surface, wherein the components have component contacts (5a), which are electrically connected selectively by way of vias (7) in the circuit substrate (3) and the conductor configuration (3b), wherein the circuit substrate is a thermoplastic polymer and the component contacts (5a) are melted or thermally pressed into the second substrate surface in the region of the vias (7).
