An imaging unit 40 includes a solid state image sensor 44 that generates an electric signal by receiving light and performing photoelectric conversion thereon, a substrate 45 that extends from the solid state image sensor 44 in an optical axis direction of the solid state image sensor 44, a multi-layer substrate 46 formed on a surface of the substrate 45, and the multi-layer substrate 46 having a plurality of electronic components 55 to 58 mounted thereon and having a plurality of conductor layers 67 to 69 and a plurality of via holes 71 to 76 formed therein. At least one of the plurality of electronic components 55 to 58 is embedded inside the multi-layer substrate 46. The via holes 71 to 76 are formed on an outer side of the electronic components embedded inside the multi-layer substrate 46 along an optical axis direction of the multi-layer substrate 46.
