The invention provides an electronic endoscope device, an imaging module, and an image pick-up lens molding method that can prevented dew formation of an objective lens optical system and facilitate manufacture. An objective lens optical system of an imaging module includes a tip lens 50a in which a tip surface and a back surface are formed in a plane, and a recess S is formed a plane plate 50b that block the recess S and a lens barrel 51a that integrally molds and forms the entire outer peripheral surfaces of the tip lens 50a and the plane plate 50b with resin, while a state is maintained where the plane plate 50b is pressed against the tip lens 50a, and the plane plate 50b and the back surface of the tip lens 50a are directly brought into close contact with each other at an entire joining surface therebetween.
