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Sensor mounting in an implantable blood pump
专利权人:
Thoratec Corporation
发明人:
Mark McChrystal,Joseph C. Stark, III
申请号:
US14015630
公开号:
US09579436B2
申请日:
2013.08.30
申请国别(地区):
US
年份:
2017
代理人:
摘要:
Techniques for mounting a sensor are disclosed. In some implementations, a molded interconnect device carries a sensor for transducing a position of a rotor of the implantable blood pump. The molded interconnect device includes one or more integrated electronic circuit traces configured to electrically connect the Hall sensor with a printed circuit board of the implantable blood pump, and the molded interconnect device is configured to be mounted to the printed circuit board.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/
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