Bulk adhesive compounds for skin-adhesive medicinal products

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专利权人:

Hollister Incorporated

发明人:

TAYLOR, Michael,MURAHATA, Richard

申请号：

DK13754877

公开号：

DK2819627T3

申请日:

2013.02.27

申请国别(地区):

DK

年份:

2020

代理人:

摘要：

Provided are buffered adhesive compositions comprising a high molecular weight non-neutralized polymeric acid and a high molecular weight partially neutralized polymeric acid and products such as wound dressings and ostomy skin barriers incorporating the compositions.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/