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WALL THICKNESS COMPENSATION DURING LASER ORIFICE DRILLING
专利权人:
发明人:
Rong Gu,David L. Wall,Sergey V. Broude
申请号:
US14557027
公开号:
US20160151114A1
申请日:
2014.12.01
申请国别(地区):
US
年份:
2016
代理人:
摘要:
Methods and systems for drilling precise orifices in a wall of non-uniform thickness are provided. In one aspect, a thickness profile of at least a portion of the wall is created and the wall is irradiated with at least one laser beam to ablate a portion of the wall to thereby form an orifice in the wall. During the irradiation, one or more parameters of the least one laser beam are adjusted one or more times in accordance with the thickness profile to compensate for the non-uniform thickness of the wall.
来源网站:
中国工程科技知识中心
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http://www.ckcest.cn/home/

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