A lid for a blister package has a continuous pattern of wire on an adhesive surface of a substrate. The continuous pattern has multiple detector segments, and the detector segments have respective destructible portions of wire at locations on the substrate corresponding to cavities of a blister sheet. Each detector segment has an outer connector portion and an inner connector portion. The outer connector portion and the inner connector portion of each detector segment are adjacent, and pairs of successive detector segments are connected by the inner connector portion of the one detector segment and the outer connector portion of the next detector segment. The continuous pattern of wire is severed at the outer connector portions and inner connector portions of the plurality of detector segments in order to disconnects the detector segments one from another, and form terminal ends of the detector segments.
