Larry F. Rhodes,Leah J. Langsdorf,Venkat Ram Dukkipati
申请号：
US13339784
公开号：
US08633259B2
申请日:
2011.12.29
申请国别(地区):
US
年份:
2014
代理人:
摘要：
Embodiments in accordance with the present invention are directed to polymer compositions that are useful for forming temporary bonding layers that serve to releasably join a first substrate to a second substrate as well as methods of both forming such a temporary bond and methods of debonding such substrates. Some such polymer compositions encompass a casting solvent, a photoacid generator and optionally a sensitizer and/or an adhesion promoter.
