An ultrasound probe including: a circuit substrate (23) having a recess in a first region on the lower surface side； a buffer layer (400) composed of an insulating material on a second region different from the first region of circuit substrate (23)； and an element array layer (22) including a first piezoelectric element (100) for ultrasound transmission formed in the first region of the circuit substrate (23) without the buffer layer (400), and a second piezoelectric element (200) for ultrasound reception formed in the second region of the circuit substrate (23) on the buffer layer (400). The first piezoelectric element (100) vibrates in a flexural vibration mode on the circuit substrate (23), and the second piezoelectric element (200) vibrates in a thickness vibration mode on the circuit substrate (23).
