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SUPRA AORTIC ACCESS MODULAR STENT ASSEMBLY AND METHOD
专利权人:
Medtronic Vascular; Inc.
发明人:
Keith Perkins,Zachary Borglin,Mark Stiger,Julie Benton,Steven Claessens,Travis Rowe,Mark Young
申请号:
US16367906
公开号:
US20200306064A1
申请日:
2019.03.28
申请国别(地区):
US
年份:
2020
代理人:
摘要:
The techniques of this disclosure generally relate to a modular stent device that is deployed via supra aortic access through the brachiocephalic artery. The modular stent device is a base or anchor component to which additional modular stent devices can be attached to exclude diseased areas of the aorta while at the same time allowing perfusion of the left common carotid artery and the left subclavian artery.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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