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Copper salts of ion exchange materials for use in the treatment and prevention of infections
专利权人:
Inc.;CareFusion 2200
发明人:
Tufts Jr., Scott A.,Bardwell, James,Baltezor, Michael J.
申请号:
AU2010315083
公开号:
AU2010315083A1
申请日:
2010.11.05
申请国别(地区):
AU
年份:
2012
代理人:
摘要:
The present invention relates generally to copper salts of ion exchange materials that provide copper ions at levels suitable for use as an anti-infective agent. In certain aspects of the invention, copper salts of cellulose derivatives are provided. The copper salts of ion exchange materials may be formed using ether and ester derivatives of cellulose, such as carboxymethyl cellulose (CMC), ethylcellulose (EC), methylcellulose (MC), hydroxypropyl cellulose (HPC), hydroxypropyl methyl cellulose (HPMC), hydroxyethyl methyl cellulose (HEMC), cellulose acetate, and cellulose triacetate. The present invention also relates to wound dressings having copper salts of ion exchange materials incorporated therein. The copper salts of ion exchange materials may produce an equilibrium of copper ions in a wound at a level that is therapeutically-effective for preventing infection. Wound dressings containing copper salts of ion exchange materials may be used in accordance with methods of reducing the incidence of infection in wounds such as lacerations, abrasions, and burns. The wound dressings may also be used in accordance with methods for preventing infections in long-term wounds, such as those formed at wound drain, catheter, and ostomy entry sites. In further aspects of the invention, copper salts of ion exchange materials may be used to carry out methods of killing microorganisms, and may optionally be used in conjunction with additional anti-infective agents.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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