Disclosed is an ultrasonic probe (1). The ultrasonic probe comprises an acoustic window (2), a matching layer (3), a piezoelectric layer (4), a backing block (5), and a probe shell (6), all of which are sequentially connected, wherein a first heat dissipation element (7) is arranged inside the backing block (5), and the first heat dissipation element (7) comprises a first end adjacent to or extending to an upper surface (51) of the backing block (5), and a second end extending to a lower surface (52) or a first side surface (53) of the backing block (5)； and a first included angle is formed between an extension direction, from the first end to the second end, of the first heat dissipation element (7) and a thickness direction, from the upper surface (51) of the backing block (5) to the lower surface (52) of the backing block (5), of the backing block. The reflection path of acoustic waves in the backing block (5) is increased, helping the backing block (5) better absorb useless acoustic waves radiated by the piezoelectric layer (4), meanwhile, a heat conduction area is enlarged, and heat conduction efficiency is improved, so that heat exchange between the backing block (5) and the middle of the piezoelectric layer (4) is sufficient, the heat dissipation effect of the ultrasonic probe (1) is good, and it can be guaranteed that the ultrasonic probe (1) can be in a low-temperature state even during long-term use.L'invention concerne une sonde ultrasonore (1). La sonde ultrasonore comprend une fenêtre acoustique (2), une couche d'adaptation (3), une couche piézoélectrique (4), un bloc de support (5) et une enveloppe de sonde (6), qui sont tous reliés à la suite les uns des autres, un premier élément de dissipation de chaleur (7) étant agencé à l'intérieur du bloc de support (5), et le premier élément de dissipation de chaleur (7) comprenant une première extrémité adjacente à une surface supérieure (51) du bloc de support (5) ou se prolongeant jusqu'à celle-ci, et une se
